MPX2102 Просмотр технического описания (PDF) - Freescale Semiconductor
Номер в каталоге
Компоненты Описание
производитель
MPX2102
Freescale Semiconductor
MPX2102 Datasheet PDF : 14 Pages
| |||
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: VOUT = VOFF + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 2) or (2)
a least squares best line fit. While a least squares fit gives the
“best case” linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user.
Freescale’s specified pressure sensor linearities are based
on the end point straight line method measured at the
midrange pressure.
Least Squares Fit
Exaggerated
Performance
Curve
Least
Square
Deviation
Straight Line
Deviation
End Point Straight
Line Fit
Offset
0
50
100
Pressure (% Fullscale)
Figure 2. Linearity Specification Comparison
ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION
Figure 3 shows the output characteristics of the MPX2102/
MPXV2102G series at 25°C. The output is directly
proportional to the differential pressure and is essentially a
straight line.
The effects of temperature on Full Scale Span and Offset
are very small and are shown under Operating
Characteristics.
Silcone Gel
Die Coat
Wire Bond
40 VS = 10 VDC
35
TA = 25°C
MPX2102
30 P1 > P2
25
20
MAX
15
10
5
0
-5
kPa 0
25
PSI
3.62
TYP
MIN
50
7.25
75
10.88
Span
Range
(TYP)
Offset
100
(TYP)
14.5
Figure 3. Output vs. Pressure Differential
Differential/Gauge
Die
P1
Stainless Steel
Metal Cover
Epoxy
Case
Silicone Gel
Die Coat
Wire Bond
Absolute
Die
P1
Stainless Steel
Metal Cover
Epoxy
Case
Lead Frame
Differential/GaugeElement
P2
Bond
Lead Frame
Die
Absolute Element
Die
P2
Bond
Figure 4. Cross Sectional Diagrams (Not to Scale)
Figure 4 illustrates the absolute sensing configuration
(right) and the differential or gauge configuration in the basic
chip carrier (Case 344). A silicone gel isolates the die surface
and wire bonds from the environment, while allowing the
pressure signal to be transmitted to the silicon diaphragm.
The MPX2102/MPXV2102G series pressure sensor
operating characteristics and internal reliability and
qualification tests are based on use of dry air as the pressure
media. Media other than dry air may have adverse effects on
sensor performance and long term reliability. Contact the
factory for information regarding media compatibility in your
application.
MPX2102
4
Sensors
Freescale Semiconductor
Share Link: