MPX2010 Просмотр технического описания (PDF) - Motorola => Freescale

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MPX2010

10 kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors

Motorola => Freescale 

MPX2010 MPXV2010G SERIFErSeescale Semiconductor, Inc.

SMALL OUTLINE PACKAGE DIMENSIONS—CONTINUED

2 PLACES 4 TIPS

0.006 (0.15) C A B

A

E

e

5

4

e/2

D

GAGE

PLANE

.014 (0.35) θ

8

F

B

E1

N

1

8X b

0.004 (0.1) M C A B

STYLE 1:

PIN 1. GND

2. +Vout

3. Vs

4. -Vout

5. N/C

6. N/C

7. N/C

8. N/C

STYLE 2:

PIN 1. N/C

2. Vs

3. GND

4. Vout

5. N/C

6. N/C

7. N/C

8. N/C

∅T

A

M

8X 0.004 (0.1)

P

K

DETAIL G

C

SEATING

PLANE

CASE 1351–01

ISSUE O

L

A1

DETAIL G

NOTES:

1. CONTROLLING DIMENSION: INCH.

2. INTERPRET DIMENSIONS AND TOLERANCES PER

ASME Y14.5M-1994.

3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD

FLASH OR PROTRUSIONS. MOLD FLASH OR

PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)

PER SIDE.

4. DIMENSION "b" DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR PROTRUSION

SHALL BE 0.008 (0.203) MAXIMUM.

INCHES

MILLIMETERS

DIM MIN MAX MIN MAX

A 0.370 0.390 9.39 9.91

A1 0.002 0.010 0.05 0.25

b 0.038 0.042 0.96 1.07

D 0.465 0.485 11.81 12.32

E 0.680 0.700 17.27 17.78

E1 0.465 0.485 11.81 12.32

e

0.100 BSC

2.54 BSC

F 0.240 0.260 6.10 6.60

K 0.115 0.135 2.92 3.43

L 0.040 0.060 1.02 1.52

M 0.270 0.290 6.86 7.37

N 0.160 0.180 4.06 4.57

P 0.009 0.011 0.23 0.28

T 0.110 0.130 2.79 3.30

θ

0°

7°

0°

7°

6

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