MPX2010 Просмотр технического описания (PDF) - Motorola => Freescale
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MPX2010
Motorola => Freescale
MPX2010 Datasheet PDF : 12 Pages
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Freescale Semiconductor, MInPcX2. 010 MPXV2010G SERIES
ON–CHIP TEMPERATURE COMPENSATION and CALIBRATION
30
25
20
15
10
5
0
-5
kPa
PSI
VS = 10 Vdc
TA = 25°C
P1 > P2
aMAX
2.5
0.362
TYP
MIN
5
7.5
0.725
1.09
SPAN
RANGE
(TYP)
OFFSET
10 (TYP)
1.45
Figure 2. Output versus Pressure Differential
Figure 2 shows the output characteristics of the
MPX2010/MPXV2010G series at 25°C. The output is direct-
ly proportional to the differential pressure and is essentially a
straight line.
The effects of temperature on full scale span and offset are
very small and are shown under Operating Characteristics.
This performance over temperature is achieved by having
both the shear stress strain gauge and the thin–film resistor
circuitry on the same silicon diaphragm. Each chip is dynam-
ically laser trimmed for precise span and offset calibration
and temperature compensation.
STAINLESS STEEL
SILICONE
METAL COVER
ÉÉÉÉÉÉÉÉÉÉÉ WIRE BOND
DIE COAT DIE
P1
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ LEAD FRAME
ÉÉÉÉÉÉÉÉÉÉÉ P2
EPOXY
CASE
RTV DIE
BOND
Figure 3. Unibody Package — Cross–Sectional
Diagram (not to scale)
Figure 3 illustrates the differential/gauge die in the basic
chip carrier (Case 344). A silicone gel isolates the die surface
and wire bonds from the environment, while allowing the pres-
sure signal to be transmitted to the silicon diaphragm.
The MPX2010/MPXV2010G series pressure sensor oper-
ating characteristics and internal reliability and qualification
tests are based on use of dry air as the pressure media. Me-
dia other than dry air may have adverse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your application.
Motorola Sensor Device Data For More Information On This Product,
3
Go to: www.freescale.com
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