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SPC5645SF0CLT

Qorivva MPC5645S Microcontroller

Freescale Semiconductor 

Freescale Semiconductor

Data Sheet: Advance Information

Document Number: MPC5645S

Rev. 8, 08/2012

MPC5645S

416 TEPBGA

27 mm × 27 mm

208 LQFP

28 mm × 28 mm

Qorivva MPC5645S

Microcontroller Data Sheet

The Qorivva MPC5645S represents a new generation of

32-bit microcontrollers targeting single-chip automotive

instrument cluster applications. MPC5645S devices are part

of the MPC56xxS family of Power Architecture®-based

devices. This family has been designed with an emphasis on

providing cost-effective and high quality graphics capabilities

in order to satisfy the increasing market demand for color

Thin Film Transistor (TFT) displays within the vehicle

cockpit. Traditional cluster functions, such as gauge drive,

real time counter, and sound generation are also integrated on

each device.

Devices in the MPC56xxS family contain between 256 KB

and 2 MB internal flash memory. The family allows for easy

expansion and covers a broad range of cluster applications

from low to high-end enabling users to design a complete

platform around one common architecture. Serial flash

memory and DRAM interfaces are provided to allow even

greater system flexibility.

The MPC5645S is designed to reduce development and

production costs of TFT-based instrument cluster displays by

providing a single-chip solution with the processing and

storage capacity to host and execute real-time application

software and drive TFT displays directly.

The MPC5645S features a 2D OpenVG graphics accelerator,

Video Input Unit (VIU2) and two on-chip display control

units (DCU3 and DCULite) designed to drive two color TFT

displays simultaneously. The MPC5645S includes an

enhanced QuadSPI Serial Flash Controller and an optional

DRAM controller allowing graphics RAM expansion

externally.

The MPC5645S is compatible with the existing development

infrastructure of current Power Architecture devices and are

supported with software drivers, operating systems and

configuration code to assist with application development.

176 LQFP

24 mm × 24 mm

1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.1 Device comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.2 Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

1.3 Feature list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

1.4 Feature details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2 Pinout and signal descriptions . . . . . . . . . . . . . . . . . . . . . . . . 24

2.1 176 LQFP package pinout . . . . . . . . . . . . . . . . . . . . . . 24

2.2 208 LQFP package pinout . . . . . . . . . . . . . . . . . . . . . . 25

2.3 416 TEPBGA package pinout. . . . . . . . . . . . . . . . . . . . 26

2.4 Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

3 System design information. . . . . . . . . . . . . . . . . . . . . . . . . . . 59

3.1 Power-up sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . 59

4 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

4.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

4.2 Parameter classification . . . . . . . . . . . . . . . . . . . . . . . . 60

4.3 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . 60

4.4 Recommended operating conditions . . . . . . . . . . . . . . 61

4.5 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . 63

4.6 EMI (electromagnetic interference) characteristics . . . 68

4.7 Power management . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

4.8 DC electrical specifications . . . . . . . . . . . . . . . . . . . . . 73

4.9 RESET electrical characteristics . . . . . . . . . . . . . . . . . 81

4.10 Fast external crystal oscillator (4–16 MHz) electrical

characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84

4.11 Slow external crystal oscillator (32 KHz) electrical

characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85

4.12 FMPLL electrical characteristics. . . . . . . . . . . . . . . . . . 86

4.13 Fast internal RC oscillator (16 MHz) electrical

characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87

4.14 Slow internal RC oscillator (128 kHz) electrical

characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87

4.15 Flash memory electrical characteristics . . . . . . . . . . . . 88

4.16 ADC parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88

4.17 AC specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95

4.18 AC timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101

5 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . 130

5.1 176 LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131

5.2 208 LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133

5.3 416 TEPBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137

6 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139

7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140

This document contains information on a product under development. Freescale reserves the

right to change or discontinue this product without notice.

© Freescale Semiconductor, Inc., 2010–2012. All rights reserved.

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