MPC7457(2004) Просмотр технического описания (PDF) - Freescale Semiconductor
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MPC7457 Datasheet PDF : 68 Pages
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General Parameters
4 General Parameters
The following list provides a summary of the general parameters of the MPC7457:
Technology
0.13 µm CMOS, nine-layer metal
Die size
9.1 mm × 10.8 mm
Transistor count
58 million
Logic design
Fully-static
Packages
MPC7447: Surface mount 360 ceramic ball grid array (CBGA)
MPC7457: Surface mount 483 ceramic ball grid array (CBGA)
Core power supply
1.3 V ±50 mV DC nominal
I/O power supply
1.8 V ±5% DC, or
2.5 V ±5% DC, or
1.5 V ±5% DC (L3 interface only, not implemented on MPC7447)
5 Electrical and Thermal Characteristics
This section provides the AC and DC electrical specifications and thermal characteristics for the MPC7457.
5.1 DC Electrical Characteristics
The tables in this section describe the MPC7457 DC electrical characteristics.Table 2 provides the absolute
maximum ratings.
Table 2. Absolute Maximum Ratings 1
Characteristic
Core supply voltage
PLL supply voltage
Processor bus supply voltage
L3 bus supply voltage
Input voltage
BVSEL = 0
BVSEL = HRESET or OVDD
L3VSEL = ¬HRESET
L3VSEL = 0
L3VSEL = HRESET or GVDD
Processor bus
L3 bus
JTAG signals
Symbol Maximum Value
VDD
AVDD
OVDD
OVDD
GVDD
GVDD
GVDD
Vin
Vin
Vin
–0.3 to 1.60
–0.3 to 1.60
–0.3 to 1.95
–0.3 to 2.7
–0.3 to 1.65
–0.3 to 1.95
–0.3 to 2.7
–0.3 to OVDD + 0.3
–0.3 to GVDD + 0.3
–0.3 to OVDD + 0.3
Unit Notes
V
2
V
2
V
3, 4
V
3, 5
V
3, 6
V
3, 7
V
3, 8
V
9, 10
V
9, 10
V
MPC7457 RISC Microprocessor Hardware Specifications, Rev. 5
10
Freescale Semiconductor
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