MP03HBN190 Просмотр технического описания (PDF) - Dynex Semiconductor
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MP03HBN190 Datasheet PDF : 10 Pages
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MP03 XXX 190 Series
1200
1000 0.04 0.02 Rth(hs-a) ˚C/W
800
0.10 0.08
600
0.12
0.15
400
0.20
0.30
200 0.40
R - Load
L - Load
00 20 40 60 80 100 0
Maximum ambient temperature - (˚C)
100
200
300
400
D.C. output current - (A)
Fig. 9 50/60Hz single phase bridge dc output current vs power loss and maximum permissible ambient temperature for
various values of heatsink thermal resistance.
(Note: R values given above are true heatsink thermal resistances to ambient and already account for R module contact thermal).
th(hs-a)
th(c-hs)
1200
1000
0.08
800
0.10
600 0.12
0.15
400 0.20
0.30
200 0.40
Rth(hs-a) ˚C/W
0.04 0.02
R & L- Load
00 20 40 60 80 100 0
Maximum ambient temperature - (˚C)
100
200
300
400
D.C. output current - (A)
Fig. 9 50/60Hz 3- phase bridge dc output current vs power loss and maximum permissible ambient temperature for various
values of heatsink thermal resistance.
(Note: Rth(hs-a) values given above are true heatsink thermal resistances to ambient and already account for Rth(c-hs) module contact thermal).
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