MLX90129 Просмотр технического описания (PDF) - Melexis Microelectronic Systems

Номер в каталоге

Компоненты Описание

производитель

MLX90129

13.56MHZ SENSOR TAG / DATALOGGER IC

Melexis Microelectronic Systems  

MLX90129

13.56MHZ SENSOR TAG / DATALOGGER IC

8.1.2. ISO-15693 Features and Command set .................................................................................... 20

8.1.3. RFID interruptions ...................................................................................................................... 29

8.2. Serial Peripheral Interface (SPI)....................................................................................................... 32

8.2.1. SPI : modes of operation............................................................................................................ 32

8.2.2. Slave SPI command set .............................................................................................................. 32

8.2.3. SPI interruptions......................................................................................................................... 32

8.3. Management of communication conflicts...................................................................................... 36

9. Device Configuration ........................................................................................................................... 37

9.1. Standalone datalogger ..................................................................................................................... 37

9.1.1. Main features ............................................................................................................................. 37

9.1.2. DMA operations ......................................................................................................................... 37

9.1.3. Setup of the Automatic Logging Mode ..................................................................................... 39

9.1.4. Direct Memory Access configuration........................................................................................ 40

9.1.5. Wake-up timer / Power management configuration............................................................... 41

9.1.6. Master SPI configuration ........................................................................................................... 42

9.2. Sensor Signal Conditioner ................................................................................................................ 43

9.2.1. Block description ........................................................................................................................ 43

9.2.2. Sensors common configuration ................................................................................................ 46

9.2.3. Sensor specific configuration .................................................................................................... 48

9.3. Power management......................................................................................................................... 52

9.3.1. Power modes.............................................................................................................................. 52

9.3.2. Oscillators management ............................................................................................................ 53

9.3.3. Energy scavenging...................................................................................................................... 53

9.4. Security ............................................................................................................................................. 54

9.4.1. Communication security ............................................................................................................ 54

9.4.2. EEPROM Access security............................................................................................................ 54

10. Application Information ..................................................................................................................... 56

11. Reliability Information ....................................................................................................................... 58

12. ESD Precautions................................................................................................................................. 58

13. Package Information.......................................................................................................................... 59

14. Contact .............................................................................................................................................. 60

15. Disclaimer .......................................................................................................................................... 60

REVISION 011 - JUNE 13, 2017

3901090129

Page 5 of 60

Share Link: