MLX90129RUS-CAA-000-WP(2012) Просмотр технического описания (PDF) - Melexis Microelectronic Systems
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MLX90129RUS-CAA-000-WP Datasheet PDF : 60 Pages
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MLX90129
13.56MHZ SENSOR TAG / DATALOGGER IC
TABLE OF CONTENT
1 Functional Diagram ..........................................................................................................................................2
2 General Description..........................................................................................................................................2
3 Glossary of Terms ............................................................................................................................................3
4 Absolute Maximum Ratings..............................................................................................................................3
5 Pin definition .....................................................................................................................................................3
6 General Electrical and Timing Specifications...................................................................................................5
6.1 Power consumption........................................................................................................................................................................ 5
6.2 RFID interface ................................................................................................................................................................................ 5
6.3 SPI: electrical specification ............................................................................................................................................................. 5
6.4 Non-volatile memories.................................................................................................................................................................... 5
6.5 Slave SPI: timing specification........................................................................................................................................................ 6
6.6 Master SPI timing specifications ..................................................................................................................................................... 7
6.7 Sensor Signal Conditioner: electrical specifications ........................................................................................................................ 7
6.8 VREG regulator, and Oscillators: electrical specifications ............................................................................................................... 9
7 General Description........................................................................................................................................10
7.1 Block diagram .............................................................................................................................................................................. 10
7.2 Digital Controller and memory domains ........................................................................................................................................ 11
7.2.1 Digital controller .................................................................................................................................................................... 11
7.2.2 Address domains .................................................................................................................................................................. 11
7.3 Internal Devices............................................................................................................................................................................ 13
7.3.1 EE-Latches ........................................................................................................................................................................... 14
7.3.2 Sensors ADC buffers ............................................................................................................................................................ 15
7.4 Configuration EEPROM & Register files ....................................................................................................................................... 15
7.4.1 EEPROM Map ...................................................................................................................................................................... 15
7.4.2 Update of the Register File.................................................................................................................................................... 16
7.5 EE-Latches and EEPROM Melexis default configuration .............................................................................................................. 17
8 Communication...............................................................................................................................................18
8.1 RFID communication.................................................................................................................................................................... 18
8.1.1 RFID analog front-end........................................................................................................................................................... 18
8.1.2 ISO-15693 Features and Command set................................................................................................................................ 18
8.1.3 RFID interruptions................................................................................................................................................................. 29
8.2 Serial Peripheral Interface (SPI) ................................................................................................................................................... 32
8.2.1 SPI : modes of operation....................................................................................................................................................... 32
8.2.2 Slave SPI command set........................................................................................................................................................ 32
8.2.3 SPI interruptions ................................................................................................................................................................... 33
8.3 Management of communication conflicts ...................................................................................................................................... 36
9 Device Configuration ......................................................................................................................................37
9.1 Standalone datalogger ................................................................................................................................................................. 37
9.1.1 Main features ........................................................................................................................................................................ 37
9.1.2 DMA operations .................................................................................................................................................................... 37
9.1.3 Setup of the Automatic Logging Mode................................................................................................................................... 39
9.1.4 Direct Memory Access configuration ..................................................................................................................................... 40
9.1.5 Wake-up timer / Power management configuration ............................................................................................................... 41
9.1.6 Master SPI configuration....................................................................................................................................................... 42
9.2 Sensor Signal Conditioner............................................................................................................................................................ 43
9.2.1 Block description................................................................................................................................................................... 43
9.2.2 Sensors common configuration ............................................................................................................................................. 47
9.2.3 Sensor specific configuration ................................................................................................................................................ 48
9.3 Power management ..................................................................................................................................................................... 52
9.3.1 Power modes ........................................................................................................................................................................ 52
9.3.2 Oscillators management ....................................................................................................................................................... 53
9.3.3 Energy scavenging ............................................................................................................................................................... 53
9.4 Security ........................................................................................................................................................................................ 54
9.4.1 Communication security........................................................................................................................................................ 54
9.4.2 EEPROM Access security..................................................................................................................................................... 54
10 Application Information.................................................................................................................................56
11 Reliability Information ...................................................................................................................................58
12 ESD Precautions ..........................................................................................................................................58
13 Package Information ....................................................................................................................................59
14 Disclaimer.....................................................................................................................................................60
3901090129
Rev 009
Page 4 of 60
Data Sheet
Jun/12
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