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MIC5319 Просмотр технического описания (PDF) - Micrel

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MIC5319 Datasheet PDF : 12 Pages
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Micrel, Inc.
Because this device is CMOS and the ground current is
typically <100µA over the load range, the power
dissipation contributed by the ground current is <1% and
can be ignored for this calculation:
PD = (3.3V 2.8V) × 500mA
PD = 0.25W
To determine the maximum ambient operating
temperature of the package, use the junction-to-ambient
thermal resistance of the device and the following basic
equation:
PD(max) =
⎜⎛ TJ(max) TA ⎟⎞
θJA
MIC5319
Substituting 0.25W for PD(max) and solving for the
ambient operating temperature will give the maximum
operating conditions for the regulator circuit. The
maximum power dissipation must not be exceeded for
proper operation.
0.25W = 125°C TA
93°C/W
TA = 101.75°C
Therefore, a 2.8V application at 500mA of output current
can accept an ambient operating temperature of
101.75°C in a 2mm x 2mm MLF® package. For a full
discussion of heat sinking and thermal effects on voltage
regulators, refer to the “Regulator Thermals” section of
Micrel’s Designing with Low-Dropout Voltage Regulators
handbook. This information can be found on Micrel's
website at: www.micrel.com/_PDF/other/LDOBk_ds.pdf
TJ(max) = 125°C, the maximum junction temperature of
the die. θJA thermal resistance = 93°C/W.
Table 1 shows junction-to-ambient thermal resistance for
the MIC5319 in the 2mm x 2mm MLF® package.
Package
2mm × 2mm MLF®
SOT-23-5
θJA Recommended
Minimum Footprint
93°C/W
235°C/W
Table 1. Thermal Resistance
θJC
45°C/W
May 2010
10
M9999-052510

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