MIC2954(1999) Просмотр технического описания (PDF) - Micrel
Номер в каталоге
Компоненты Описание
производитель
MIC2954 Datasheet PDF : 12 Pages
| |||
MIC2954
or about 0.01µF. When doing this, the output capacitor must
be increased to 3.3µF to maintain stability. These changes
reduce the output noise from 430µV to 100µV rms for a
100kHz bandwidth at 5V output. With the bypass capacitor
added, noise no longer scales with output voltage so that
improvements are more dramatic at higher output voltages.
Automotive Applications
The MIC2954 is ideally suited for automotive applications for
a variety of reasons. It will operate over a wide range of input
voltages with very low dropout voltages (40mV at light loads),
and very low quiescent currents (75µA typical). These
features are necessary for use in battery powered systems,
such as automobiles. It is a “bulletproof” device with the ability
to survive both reverse battery (negative transients up to 20V
below ground), and load dump (positive transients up to 60V)
conditions. A wide operating temperature range with low
temperature coefficients is yet another reason to use these
versatile regulators in automotive designs.
Thermal Calculations
Layout Considerations
The MIC2954-07BM/-08BM (8-pin surface-mount package)
has the following thermal characteristics when mounted on a
single layer copper-clad printed circuit board.
PC Board Dielectric Material
FR4
Ceramic
θJA
160°C/W
120°C/W
Micrel
Multilayer boards having a ground plane, wide traces near the
pads, and large supply bus lines provide better thermal
conductivity.
Our calculations will use the “worst case” value of 160°C/W,
which assumes no ground plane, minimum trace widths, and
a FR4 material board.
Pad Layout (minimum recommended geometry)
245 mil
50 mil
150 mil
30 mil
50 mil
Nominal Power Dissipation and Die Temperature
The MIC2954-07BM/-08BM at a 55°C ambient temperature
will operate reliably at up to 440mW power dissipation when
mounted in the “worst case” manner described above. This
power level is equivalent to a die temperature of 125°C, the
recommended maximum temperature for nonmilitary grade
silicon integrated circuits.
Schematic Diagram
IN
FEEDBACK
Q15A
Q3
Q6
Q1
10
R1
Q42
20 kΩ
R2
50 kΩ
Q40
Q41
R11
18
kΩ
C1
20
pF
Q4
Q7
Q5
R11
20.6
kΩ
Q2
Q9
Q8
Q20
R8 R10
31.4 kΩ
150
kΩ
R5
R6
R9
180
140
27.8 kΩ
kΩ
kΩ
R12
110
Q13
Q12
kΩ
Q11
R30
30
kΩ
R3
R4
50 kΩ
13 kΩ
50 kΩ
10 kΩ
ERROR
Q37
Q36
Q38
R26
60 kΩ
Q39
Q34
R25
2.8 kΩ
Q15B
R18
20kΩ
Q26
Q25
Q24
OUT
Q16 Q17
R17
Q14
12 kΩ
SENSE
R27
182 kΩ
5V TAP
R28
60 kΩ
R13
100
kΩ
Q18
Q21
C2
40 pF
R14
350
kΩ
Q29
Q19
Q22
Q23
R15
100 kΩ
R16
30 kΩ
R17
10 Ω
Q28
R22
150 kΩ
Q30 Q31
R21 8 Ω
R24
50 kΩ
R23 60 kΩ
SHDN
GND
DENOTES CONNECTION ON
MIC2954-02Bx/-03Bx ONLY
MIC2954
10
August 1999
Share Link: 