NDS03ZD Просмотр технического описания (PDF) - Power-One Inc.
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NDS03ZD Datasheet PDF : 14 Pages
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NDS Series: 10W / 3.0A DC/DC Converters
36-75V Input
1.5V, 1.8V, 2.5V, 3.3V and 5.0V Outputs
Product Specifications
Nov 2001
Surface Mount Assembly
Soldering:
The following instructions must be observed when
soldering the unit. Failure to observe these
instructions may result in failure or significant
degradation of the module performance. Power-
One will not honor any warranty claims arising from
failure to observe these instructions.
This product is approved for forced convection
reflow soldering only.
The curves below define the maximum peak reflow
temperature permissible measured on Pins 1 and
10 of the converter.
The lead-frame is constructed for a high
temperature glass filled, UL94V0 flame retardant,
diallyl ortho-phthalate moulding compound
commonly used for packaging of electronics
components. It has passed NASA outgassing
tests and is certified to MIL-M-14. The coefficient
of thermal expansion is equivalent to FR4.
The gull wing leads are formed to ensure optimal
solder joint strength and structure. Furthermore
they facilitate visual inspection (manual or
automatic). The leads are formed from a 97% Cu
alloy plated with Cu and Sn 90. This material is
commonly used in the manufacture of integrated
circuits. It has good corrosion resistance and
exhibits the nobility inherent to all high copper
alloys. Unlike brasses, this material is essentially
immune to stress corrosion cracking. It also
exhibits excellent solderability. It is readily wetted
by solders and performs well in standard
solderability tests. (Dip of Class II or better).
The product is manufactured with a patented
process, which is fully automated, and ‘in-line’.
This ensures that there is no contamination or
mechanical stress on the lead-frame so that the co
planarity and solderability are maintained.
The product is shipped in JEDEC trays to
guarantee preservation of the co-planarity and
enable fully automated assembly in the final
application.
.
300
250
Max. temp. on pins 1 and 10 during reflow
soldering (deg C)
Peak Temperature
(See fig below)
200
150
tp
100
50
0
190 – 450 s
Time (s)
Restriction curve above 215ºC
Peak temp. at pins 1 and 10 (ºC)
245
240
235
230
225
220
215
210
205
200
10 20 30 40 50 60
tp (s)
Pick & Place Assembly:
The product is designed with a large flat area in the
center of the top surface to serve as a pick up point
for automated vacuum pick and place equipment.
The ‘open board’ construction of the unit ensures
that weight is kept to a minimum. However due to
the relatively large size of the component, a large
nozzle (> 3.0mm, depending on vacuum pressure)
is recommended for picking and placing.
The unit may also be automatically handled using
‘odd-form’ placement equipment, with mechanical
grippers. For this type of equipment the end edges
of the device, which have no leads and also feature
the greatest dimensional accuracy, should be used
as pick-up points.
5-Nov-01
Rev 1.1
www.power-one.com
Page 11 of 14
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