MCS0402AT Просмотр технического описания (PDF) - Vishay Semiconductors
Номер в каталоге
Компоненты Описание
производитель
MCS0402AT Datasheet PDF : 12 Pages
| |||
MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Professional
www.vishay.com
Vishay Beyschlag
DIMENSIONS
Tt
W WT
H
Tb
L
DIMENSIONS AND MASS
TYPE / SIZE
H
(mm)
L
(mm)
MCS 0402 AT 0.32 ± 0.05
1.0 ± 0.05
MCT 0603 AT 0.45 + 0.1/- 0.05 1.55 ± 0.05
MCU 0805 AT 0.52 ± 0.1
2.0 ± 0.1
MCA 1206 AT 0.55 ± 0.1 3.2 + 0.1/- 0.2
W
(mm)
0.5 ± 0.05
0.85 ± 0.1
1.25 ± 0.15
1.6 ± 0.15
WT
(mm)
Tt
(mm)
Tb
(mm)
> 75 % of W 0.2 + 0.1/- 0.15 0.2 ± 0.1
> 75 % of W 0.3 + 0.15/- 0.2 0.3 + 0.15/- 0.2
> 75 % of W 0.4 + 0.1/- 0.2 0.4 + 0.1/- 0.2
> 75 % of W
0.5 ± 0.25
0.5 ± 0.25
MASS
(mg)
0.6
1.9
4.6
9.2
SOLDER PAD DIMENSIONS
G
X
Y
Z
RECOMMENDED SOLDER PAD DIMENSIONS
TYPE / SIZE
G
(mm)
WAVE SOLDERING
Y
(mm)
X
(mm)
Z
(mm)
G
(mm)
REFLOW SOLDERING
Y
(mm)
X
(mm)
Z
(mm)
MCS 0402 AT
-
-
-
-
0.35
0.55
0.55
1.45
MCT 0603 AT
0.55
1.10
1.10
2.75
0.65
0.70
0.95
2.05
MCU 0805 AT
0.80
1.25
1.50
3.30
0.90
0.90
1.40
2.70
MCA 1206 AT
1.40
1.50
1.90
4.40
1.50
1.15
1.75
3.80
Notes
• The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x (1),
or in publication IPC-7351.
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents.
Revision: 01-Mar-17
11
Document Number: 28760
For technical questions, contact: thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Share Link: 