MCS0402AT Просмотр технического описания (PDF) - Vishay Semiconductors
Номер в каталоге
Компоненты Описание
производитель
MCS0402AT Datasheet PDF : 12 Pages
| |||
MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Professional
www.vishay.com
Vishay Beyschlag
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2 (1)
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 0.5 OR BETTER
Stability for product types:
MCS 0402 AT
2.43 to 221 k
MCT 0603 AT
1 to 511 k
MCU 0805 AT
1 to 1 M
MCA 1206 AT
1 to 1 M
Single pulse high
voltage overload:
standard operation mode
Severity no. 4:
U = 10 x P70 x R
± (0.25 % R + 0.05)
4.27
-
Single pulse high
U = 2 x Umax.;
whichever is the less severe;
voltage overload:
power operation mode
10 pulses 10 μs/700 μs
± (0.5 % R + 0.05)
Periodic electric
overload:
U = 15 x P70 x R
± (0.5 % R + 0.05)
standard operation mode
U = 2 x Umax.
4.39
-
whichever is the less severe;
Periodic electric
overload:
power operation mode
0.1 s on; 2.5 s off;
1000 cycles
± (1.0 % R + 0.05)
IEC 61340-3-1 (1);
3 pos. + 3 neg.
(equivalent to MIL-STD-883,
4.38
-
Electro static discharge
(human body model)
method 3015)
MCS 0402 AT: 500 V
± (0.5 % R + 0.05)
MCT 0603 AT: 1000 V
MCU 0805 AT: 1500 V
MCA 1206 AT: 2000 V
4.22
6 (Fc)
Vibration
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance;
amplitude 1.5 mm or
200 m/s2; 7.5 h
± (0.1 % R + 0.01)
no visible damage
4.17
58 (Td)
Solderability
Solder bath method;
SnPb40; non-activated flux
(215 ± 3) °C; (3 ± 0.3) s
Solder bath method;
SnAg3Cu0.5 or SnAg3.5;
non-activated flux;
(235 ± 3) °C; (2 ± 0.2) s
Good tinning ( 95 % covered);
no visible damage
Good tinning (95 % covered);
no visible damage
4.18
58 (Td)
Resistance to
soldering heat
Solder bath method;
(260 ± 5) °C; (10 ± 1) s
± (0.1 % R + 0.01)
no visible damage
4.29
45 (XA)
Component solvent
resistance
Isopropyl alcohol +50 °C;
method 2
No visible damage
4.32
21 (Ue3)
Shear (adhesion)
MCS 0402 AT and
MCT 0603 AT; 9 N
MCU 0805 AT and
MCA 1206 AT; 45 N
No visible damage
4.33
21 (Ue1)
Substrate bending
Depth 2 mm, 3 times
± (0.1 % R + 0.01)
no visible damage;
no open circuit in bent position
4.7
-
4.35
-
Voltage proof
Flammability
URMS = Uins; (60 ± 5) s
IEC 60695-11-5 (1)
needle flame test; 10 s
No flashover or breakdown
No burning after 30 s
Notes
(1) The quoted IEC standards are also released as EN standards with the same number and identical contents.
(2) Tested on a 4-layer printed circuit board with SAC micro alloy.
Revision: 01-Mar-17
10
Document Number: 28760
For technical questions, contact: thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Share Link: 