MCS0402AT(2009) Просмотр технического описания (PDF) - Vishay Semiconductors

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производитель

MCS0402AT
(Rev.:2009)

Professional Thin Film Chip Resistor Superior Moisture Resistivity

Vishay Semiconductors 

MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Professional

Professional Thin Film Chip Resistor

Superior Moisture Resistivity

Vishay Beyschlag

TEST PROCEDURES AND REQUIREMENTS

EN

60115-1

CLAUSE

IEC

60068-2

TEST

METHOD

TEST

PROCEDURE

Stability for product types:

MCS 0402 AT

MCT 0603 AT

MCU 0805 AT

MCA 1206 AT

REQUIREMENTS

PERMISSIBLE CHANGE (ΔR)

STABILITY CLASS 0.5 OR BETTER

47 Ω to 47 kΩ

47 Ω to 100 kΩ

47 Ω to 100 kΩ

47 Ω to 100 kΩ

Single pulse high

voltage overload;

Severity no. 4:

4.27

-

standard operation mode

Single pulse high

U

= 10 x

≤2x

UPm7a0x.;x

R

voltage overload;

10 pulses

power operation mode

± (0.25 % R + 0.05 Ω)

± (0.5 % R + 0.05 Ω)

4.37

-

Periodic electric overload;

standard operation mode

Periodic electric overload;

U = ≤ 125xxUPm7a0x.;x R

0.1 s on; 2.5 s off;

power operation mode

1000 cycles

± (0.5 % R + 0.05 Ω)

± (1.0 % R + 0.05 Ω)

IEC 61340-3-1;

3 pos. + 3 neg.

(equivalent to MIL-STD-883,

4.40

-

ESD

(Electro Static Discharge)

Method 3015)

MCS 0402 AT: 500 V

MCT 0603 AT: 1000 V

MCU 0805 AT: 1500 V

MCA 1206 AT: 2000 V

± (0.5 % R + 0.05 Ω)

4.22

6 (Fc)

Vibration

Endurance by sweeping;

10 Hz to 2000 Hz;

no resonance;

amplitude ≤ 1.5 mm or

≤ 200 m/s2; 6 h

± (0.1 % R + 0.01 Ω)

no visible damage

4.17.2

58 (Td)

Solderability

Solder bath method;

SnPb40; non-activated flux

(215 ± 3) °C; (3 ± 0.3) s

Solder bath method;

SnAg3Cu0.5 or SnAg3.5;

non-activated flux;

(235 ± 3) °C; (2 ± 0.2) s

Good tinning (≥ 95 % covered);

no visible damage

Good tinning (≥ 95 % covered);

no visible damage

4.18.2

58 (Td)

Resistance to

soldering heat

Solder bath method;

(260 ± 5) °C; (10 ± 1) s

± (0.1 % R + 0.01 Ω)

no visible damage

4.29

45 (XA)

Component solvent

resistance

Isopropyl alcohol + 50 °C;

method 2

No visible damage

4.32

21 (Ue3)

Shear (adhesion)

4.33

21 (Ue1)

Substrate bending

4.7

-

4.35

-

Voltage proof

Flammability

RR 1005M and

RR 1608M; 9 N

RR 2012M and

RR 3216M; 45 N

Depth 2 mm, 3 times

URMS = Uins; (60 ± 5) s

Needle flame test; 10 s

No visible damage

± (0.1 % R + 0.01 Ω)

no visible damage; no open circuit in bent position

No flashover or breakdown

No burning after 30 s

Document Number: 28760

Revision: 07-Dec-09

For technical questions, contact: thinfilmchip@vishay.com

www.vishay.com

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