MCR106 Просмотр технического описания (PDF) - ON Semiconductor
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MCR106 Datasheet PDF : 4 Pages
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MCR106−6, MCR106−8
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Ambient
Maximum Lead Temperature for Soldering Purposes 1/8″ from Case for 10 Seconds
Symbol
RqJC
RqJA
TL
Max
Unit
3.0
°C/W
75
°C/W
260
°C
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted.)
Characteristic
OFF CHARACTERISTICS
Peak Repetitive Forward or Reverse Blocking Current
(VAK = Rated VDRM or VRRM; RGK = 1000 Ohms)
ON CHARACTERISTICS
TJ = 25°C
TJ = 110°C
Peak Forward On−State Voltage (Note 3)
(ITM = 4 A Peak)
Gate Trigger Current (Continuous dc) (Note 4)
(VAK = 7 Vdc, RL = 100 Ohms)
(TC = −40°C)
Gate Trigger Voltage (Continuous dc) (Note 4)
(VAK = 7 Vdc, RL = 100 Ohms)
Gate Non-Trigger Voltage (Note 4)
(VAK = 12 Vdc, RL = 100 Ohms, TJ = 110°C)
Holding Current
(VAK = 7 Vdc, Initiating Current = 200 mA, Gate Open)
DYNAMIC CHARACTERISTICS
Critical Rate−of−Rise of Off−State Voltage
(TJ = 110°C)
3. Pulse Test: Pulse Width ≤ 1.0 ms, Duty Cycle ≤ 1%.
4. RGK current is not included in measurement.
ORDERING INFORMATION
Device
MCR106−6
MCR106−6G
MCR106−8
MCR106−8G
Package
TO−225AA
TO−225AA
(Pb−Free)
TO−225AA
TO−225AA
(Pb−Free)
Symbol
Min Typ Max Unit
IDRM, IRRM
−
−
−
10
mA
−
200
mA
VTM
−
−
2.0
V
IGT
mA
−
−
200
−
−
500
VGT
−
−
1.0
V
VGD
0.2
−
−
V
IH
−
−
5.0
mA
dv/dt
−
10
−
V/ms
Shipping
500 Units / Box
500 Units / Box
500 Units / Box
500 Units / Box
http://onsemi.com
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