APPENDIX A: REVISION HISTORY
Revision C (January 2013)
Added a note to each package outline drawing.
Revision B (September 2005)
The following is the list of modifications:
1. Changed pin 6 in Package Types diagram on
front page.
2. Removed device qualification note in Package
Marking section.
3. Removed device qualification note in Package
Outline drawing.
4. Removed device qualification note in Package
Identification System section
5. Replaced MSOP and QFN package diagrams.
Revision A (December 2004)
• Original Release of this Document.
MCP1612
2004-2013 Microchip Technology Inc.
DS21921C-page 17