MCP1612-I Просмотр технического описания (PDF) - Microchip Technology

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MCP1612-I

Single 1A, 1.4 MHz Synchronous Buck Regulator

Microchip Technology 

MCP1612

8-Lead Plastic Dual-Flat, No-Lead Package (MF) 3x3x0.9 mm Body (DFN) – Saw Singulated

Note: For the most current package drawings, please see the Microchip Packaging Specification located

at http://www.microchip.com/packaging

D

b

p

n

EXPOSED

METAL

PAD

E

(NOTE 2)

L

E2

PIN 1

ID INDEX

AREA

(NOTE 1)

TOP VIEW

21

D2

BOTTOM VIEW

ALTERNATE EXPOSED

PAD CONFIGURATIONS

A1 A

A3

EXPOSED

TIE BAR

(NOTE 3)

Units

Dimension Limits

Number of Pins

n

Pitch

p

Overall Height

A

Standoff

A1

Contact Thickness

A3

Overall Length

E

Exposed Pad Width

E2

Overall Width

D

Exposed Pad Length

D2

Contact Width

b

Contact Length

L

INCHES

MIN

NOM

8

.026 BSC

.031

.035

.000

.001

.008 REF.

.118 BSC

.043

.061

.118 BSC

.059

.092

.009

.012

.008

.016

MAX

.039

.002

.063

.096

.015

.020

* Controlling Parameter

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Exposed pad varies according to die attach paddle size.

3. Package may have one or more exposed tie bars at ends.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

See ASME Y14.5M

REF: Reference Dimension, usually without tolerance, for information purposes only.

See ASME Y14.5M

JEDEC equivalent: M0-229

Drawing No. C04-062

MILLIMETERS*

MIN

NOM

8

0.65 BSC

0.80

0.90

0.00

0.02

0.20 REF.

3.00 BSC

1.09

1.55

3.00 BSC

1.50

2.37

0.23

0.30

0.20

0.40

MAX

1.00

0.05

1.60

2.45

0.37

0.50

Revised 07-20-05

 2004-2013 Microchip Technology Inc.

DS21921C-page 15

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