MCP1612T-ADJI/MF(2005) Просмотр технического описания (PDF) - Microchip Technology

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Компоненты Описание

производитель

MCP1612T-ADJI/MF
(Rev.:2005)

Single 1A, 1.4 MHz Synchronous Buck Regulator

Microchip Technology 

MCP1612

DC CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise noted, VIN = VCC = VSHDN = 3.3V, VOUT = 1.8V, CIN = COUT = 10 µF, L = 3.3 µH,

ILOAD = 100 mA, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +85°C.

Parameters

Sym

Min

Typ

Max

Units

Conditions

Protection Features

Undervoltage Lockout

UVLO

2.4

2.55

2.7

V Note 2

Undervoltage Lockout Hysteresis UVLO-HYS

—

Thermal Shutdown

TSHD

—

Thermal Shutdown Hysteresis

TSHD-HYS

—

Interface Signal (SHDN)

200

—

160

—

9

—

mV

°C Note 1

°C

Logic-High Input

VIN-HIGH

45

—

—

% of VIN

Logic-Low Input

VIN-LOW

—

—

15

% of VIN

Note 1:

2:

The integrated MOSFET switches have an integral diode from the LX pin to VIN and from LX to PGND. In cases where

these diodes are forward-biased, the package power dissipation limits must be adhered to. Thermal protection is not

able to regulate the junction temperature for these cases.

UVLO is specified for a falling VIN. Once the UVLO is activated, the UVLO-HYS must be overcome before the device will

return to operation.

TEMPERATURE SPECIFICATIONS

Electrical Specifications: VIN = 3.0V to 5.5V, FOSC = 1 MHz with 10% Duty Cycle, CIN = 0.1 µF. TA = -40°C to +125°C.

Parameters

Sym

Min

Typ

Max Units

Conditions

Temperature Ranges

Storage Temperature Range

TA

-65

—

+150 °C Continuous

Maximum Junction Temperature

TJ

—

—

+150 °C Transient Only

Operating Junction Temperature Range

TA

- 40

—

+ 125

°C Continuous Operation

Thermal Package Resistances

Thermal Resistance, 8L-MSOP

θJA

—

208

— °C/W Typical 4-layer board interconnecting

vias

Thermal Resistance, 8L-DFN

θJA

—

41

— °C/W Typical 4-layer board interconnecting

vias

© 2005 Microchip Technology Inc.

DS21921B-page 5

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