MCP1603 Просмотр технического описания (PDF) - Microchip Technology

Номер в каталоге

Компоненты Описание

производитель

MCP1603

2.0 MHz, 500 mA Synchronous Buck Regulator

Microchip Technology 

MCP1603/B/L

1.0 ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings †

VIN - GND.......................................................................+6.0V

All Other I/O ............................... (GND - 0.3V) to (VIN + 0.3V)

LX to GND .............................................. -0.3V to (VIN + 0.3V)

Output Short Circuit Current ................................. Continuous

Power Dissipation (Note 5) .......................... Internally Limited

Storage Temperature ....................................-65°C to +150°C

Ambient Temp. with Power Applied ................-40°C to +85°C

Operating Junction Temperature...................-40°C to +125°C

ESD Protection On All Pins:

HBM ............................................................................. 4 kV

MM ..............................................................................300V

† Notice: Stresses above those listed under "Maximum

Ratings" may cause permanent damage to the device.

This is a stress rating only and functional operation of

the device at those or any other conditions above those

indicated in the operational sections of this specifica-

tion is not intended. Exposure to maximum rating con-

ditions for extended periods may affect device

reliability.

DC CHARACTERISTICS

Electrical Characteristics: Unless otherwise indicated, MCP1603/L, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF,

L = 4.7 µH, VOUT(ADJ) = 1.8V, IOUT = 100 mA, TA = +25°C. Boldface specifications apply over the TA range of -40°C

to +85°C.

Parameters

Sym

Min Typ Max Units

Conditions

Input Characteristics

Input Voltage

Maximum Output Current

Shutdown Current

Quiescent Current - PFM

VIN

IOUT

2.7

—

5.5

V Note 1

500

—

—

mA Note 1

IIN_SHDN

—

0.1

1

µA SHDN = GND

IQ

—

45

60

µA SHDN = VIN, IOUT = 0 mA,

device switching

Quiescent Current - PWM

IQ

1.0

2.7

4

mA SHDN = VIN, IOUT = 0 mA,

device switching (MCP1603B)

Shutdown/UVLO/Thermal Shutdown Characteristics

SHDN, Logic Input Voltage Low

VIL

—

—

15

%VIN VIN = 2.7V to 5.5V

SHDN, Logic Input Voltage High

VIH

45

—

—

%VIN VIN = 2.7V to 5.5V

SHDN, Input Leakage Current

IL_SHDN

-1.0 ±0.1 1.0

µA VIN = 2.7V to 5.5V

Undervoltage Lockout

UVLO

2.12 2.28 2.43

V VIN Falling

Undervoltage Lockout Hysteresis UVLOHYS

—

140

—

mV

Thermal Shutdown

TSHD

—

150

—

°C Note 4, Note 5

Thermal Shutdown Hysteresis

TSHD-HYS

—

10

—

°C Note 4, Note 5

Note 1: The input voltage should be greater then the output voltage plus headroom voltage; higher load currents

increase the input voltage required for regulation. MCP1603B device requires a minimum load for

regulation. See Section 2.0, Typical Performance Curves for typical operating voltage ranges.

2: Reference Feedback Voltage Tolerance applies to adjustable output voltage setting.

3: VR is the output voltage setting.

4: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

temperature and the thermal resistance from junction to air (i.e. TA, TJ, JA). Exceeding the maximum

allowable power dissipation causes the device to initiate thermal shutdown.

5: The internal MOSFET switches have an integral diode from the LX pin to the VIN pin, and from the LX pin

to the GND pin. In cases where these diodes are forward-biased, the package power dissipation limits

must be adhered to. Thermal protection is not able to limit the junction temperature for these cases.

6: The current limit threshold is a cycle-by-cycle peak current limit.

 2007-2012 Microchip Technology Inc.

DS22042B-page 5

Share Link: