MCF51JF128(2011) Просмотр технического описания (PDF) - Freescale Semiconductor

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производитель

MCF51JF128
(Rev.:2011)

Embedded - Microcontrollers

Freescale Semiconductor 

Table of Contents

1 Ordering parts...........................................................................3

5.4.1 Thermal operating requirements...........................19

1.1 Determining valid orderable parts......................................3

5.4.2 Thermal attributes.................................................19

2 Part identification......................................................................3

6 Peripheral operating requirements and behaviors....................20

2.1 Description.........................................................................3

6.1 Core modules....................................................................20

2.2 Format...............................................................................3

6.1.1 Debug specifications.............................................20

2.3 Fields.................................................................................3

6.2 System modules................................................................20

2.4 Example............................................................................4

6.3 Clock modules...................................................................21

3 Terminology and guidelines......................................................4

6.3.1 MCG specifications...............................................21

3.1 Definition: Operating requirement......................................4

6.3.2 Oscillator electrical specifications.........................23

3.2 Definition: Operating behavior...........................................5

6.4 Memories and memory interfaces.....................................26

3.3 Definition: Attribute............................................................5

6.4.1 Flash (FTFL) electrical specifications....................26

3.4 Definition: Rating...............................................................5

6.4.2 EzPort Switching Specifications............................30

3.5 Result of exceeding a rating..............................................6

6.4.3 Mini-Flexbus Switching Specifications..................31

3.6 Relationship between ratings and operating

6.5 Security and integrity modules..........................................33

requirements......................................................................6

6.6 Analog...............................................................................34

3.7 Guidelines for ratings and operating requirements............6

6.6.1 ADC electrical specifications.................................34

3.8 Definition: Typical value.....................................................7

6.6.2 CMP and 6-bit DAC electrical specifications.........37

4 Ratings......................................................................................8

6.6.3 12-bit DAC electrical characteristics.....................39

4.1 Thermal handling ratings...................................................8

6.6.4 Voltage reference electrical specifications............42

4.2 Moisture handling ratings..................................................8

6.7 Timers................................................................................43

4.3 ESD handling ratings.........................................................9

6.8 Communication interfaces.................................................44

4.4 Voltage and current operating ratings...............................9

6.8.1 USB electrical specifications.................................44

5 General.....................................................................................9

6.8.2 USB DCD electrical specifications........................44

5.1 Typical Value Conditions...................................................9

6.8.3 USB VREG electrical specifications......................44

5.2 Nonswitching electrical specifications...............................10

6.8.4 SPI switching specifications..................................45

5.2.1 Voltage and Current Operating Requirements......10

6.8.5 I2S/SAI Switching Specifications..........................49

5.2.2 LVD and POR operating requirements.................11

6.9 Human-machine interfaces (HMI)......................................51

5.2.3 Voltage and current operating behaviors..............12

6.9.1 TSI electrical specifications...................................51

5.2.4 Power mode transition operating behaviors..........12

7 Dimensions...............................................................................52

5.2.5 Power consumption operating behaviors..............13

7.1 Obtaining package dimensions.........................................52

5.2.6 EMC radiated emissions operating behaviors.......16

8 Pinout........................................................................................53

5.2.7 Designing with radiated emissions in mind...........16

8.1 Signal Multiplexing and Pin Assignments..........................53

5.2.8 Capacitance attributes..........................................16

8.2 Pinout diagrams.................................................................55

5.3 Switching electrical specifications.....................................17

8.3 Module-by-module signals.................................................59

5.3.1 General Switching Specifications..........................17

9 Revision History........................................................................70

5.4 Thermal specifications.......................................................19

MCF51JF128 Advance Information Data Sheet, Rev. 2, 05/2011.

2

Preliminary

Freescale Semiconductor, Inc.

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