EMIF06-10006F1 Просмотр технического описания (PDF) - STMicroelectronics

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EMIF06-10006F1

6 LINES EMI FILTER AND ESD PROTECTION

STMicroelectronics 

EMIF06-10006F1

ORDER CODE

EMIF yy - xxx zz F 1

EMI Filter

Pitch = 500µm

Bump = 315µm

Number of lines

FLIP CHIP

x: resistance value (Ω) z: capacitance value / 10 (pF)

or

application (3 letters) and version (2 digits)

PACKAGE MECHANICAL DATA

500µm ± 50

250µm ± 50

315µm ± 50

650µm ± 65

2.92mm ± 50µm

FOOT PRINT RECOMMENDATIONS

MARKING

Copper pad Diameter :

250µm recommended , 300µm max

Solder stencil opening : 330µm

Solder mask opening recommendation :

340µm min for 300µm copper pad diameter

Dot, ST logo

xxx = marking

yww = datecode

(y = year

ww = week)

All dimensions in µm

545

400

xxx

y ww

5/6

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