MC33794 Просмотр технического описания (PDF) - Motorola => Freescale

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производитель

MC33794

Electric Field Imaging Device

Motorola => Freescale 

MAXIMUM RATINGS

All voltages are with respect to ground unless otherwise noted.

Rating

Symbol

Value

Unit

Peak VPWR Voltage

VPWRPK

40

V

Double Battery

1 Minute Maximum TA = 30°C

VDBLBAT

V

26.5

ESD Voltage

Human Body Model (Note 1)

Machine Model (Note 2)

V

VESD1

VESD2

±2000

±200

Storage Temperature

Operating Ambient Temperature

Operating Junction Temperature

Thermal Resistance

Junction-to-Ambient (Note 3)

Junction-to-Case (Note 4)

Junction-to-Board (Note 5)

Soldering Temperature (for 10 Seconds)

TSTG

TA

TJ

RθJ-A

RθJ-C

RθJ-B

TSOLDER

-55 to 150

-40 to 85

-40 to 150

41

0.2

3.0

260

°C

°C

°C

°C/W

°C

Notes

1. ESD1 performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω).

2. ESD2 performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω).

3. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient

temperature, air flow, power dissipation of other components on the board, and board thermal resistance. In accordance with SEMI G38-87

and JEDEC JESD51-2 with the single layer board horizontal.

4. Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MILSPEC 883

Method 1012.1) with the cold plate temperature used for the case temperature.

5. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface

of the board near the package.

MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA

33794

9

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