MC100ELT24(2004) Просмотр технического описания (PDF) - ON Semiconductor
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MC100ELT24 Datasheet PDF : 8 Pages
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MC10ELT24, MC100ELT24
Table 6. TTL INPUT DC CHARACTERISTICS VCC = 4.5 V to 5.5 V; VEE = −4.2 V to −5.5 V; GND = 0.0 V; TA = −40°C to +85°C
Symbol
Characteristic
Condition
Min
Typ
Max
Unit
IIH
Input HIGH Current
VIN = 2.7 V
IIHH
Input HIGH Current
VIN = 7.0 V
IIL
Input LOW Current
VIN = 0.5 V
VIK
Input Clamp Diode Voltage
IIN = −18 mA
VIH
Input HIGH Voltage
2.0
VIL
Input LOW Voltage
20
mA
100
mA
−0.6
mA
−1.2
V
V
0.8
V
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
Table 7. AC CHARACTERISTICS VCC = 4.5 V to 5.5 V; VEE = −4.2 V to −5.5 V; GND = 0.0 V
−40°C
25°C
85°C
Symbol
fmax
tPLH
Characteristic
Maximum Toggle Frequency
Propagation Delay (Note 6)
1.5 V to 50%
Min Typ Max Min Typ Max Min Typ Max Unit
400
MHz
0.5
2.0 0.5 0.95 2.0 0.5
2.0 ns
tPHL
Propagation Delay (Note 6)
1.5 V to 50%
0.5
2.0 0.5 0.8 2.0 0.5
2.0 ns
tJITTER
tr/tf
Random Clock Jitter (RMS)
Output Rise/Fall Time
(20−80%)
2.5
ps
0.25
1.25 0.25
1.25 0.25
1.25 ns
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
6. Specifications for standard TTL input signal.
7. Devices are designed to meet the AC specifications shown in the above table, after thermal equilibrium has been established. The circuit
is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained.
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