MC10EL89 Просмотр технического описания (PDF) - ON Semiconductor

Номер в каталоге

Компоненты Описание

производитель

MC10EL89

5V ECL Coaxial Cable Driver

ON Semiconductor 

MC10EL89

Table 1. PIN DESCRIPTION

PIN

Function

D, D

ECL Data Inputs

Q0, Q0; Q1, Q1

VCC

VEE

EP

ECL Data Outputs (1.6 Vpp)

Positive Supply

Negative Supply

Exposed pad must be connected to a sufficient thermal conduit.

Electrically connect to the most negative supply or leave floating open.

Table 2. ATTRIBUTES

Characteristics

Internal Input Pulldown Resistor

Internal Input Pullup Resistor

ESD Protection

Human Body Model

Machine Model

Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)

Flammability Rating

Oxygen Index: 28 to 34

Transistor Count

Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test

1. For additional information, see Application Note AND8003/D.

Value

50 KW

N/A

> 2 kV

> 100 V

Level 1

UL 94 V−0 @ 0.125 in

31

Table 3. MAXIMUM RATINGS

Symbol

Parameter

Condition 1

Condition 2

Rating

Unit

VCC

PECL Mode Power Supply

VEE

NECL Mode Power Supply

VI

PECL Mode Input Voltage

NECL Mode Input Voltage

Iout

Output Current

VEE = 0 V

VCC = 0 V

VEE = 0 V

VCC = 0 V

Continuous

Surge

VI  VCC

VI  VEE

8

V

−8

V

6

V

−6

V

50

mA

100

mA

TA

Operating Temperature Range

Tstg

Storage Temperature Range

qJA

Thermal Resistance (Junction−to−Ambient)

0 lfpm

500 lfpm

SO−8

SO−8

−40 to +85

−65 to +150

190

130

°C

°C

°C/W

°C/W

qJC

Thermal Resistance (Junction−to−Case)

Standard Board

SO−8

qJA

Thermal Resistance (Junction−to−Ambient)

0 lfpm

500 lfpm

TSSOP−8

TSSOP−8

41 to 44

185

140

°C/W

°C/W

°C/W

qJC

Thermal Resistance (Junction−to−Case)

Standard Board

TSSOP−8

qJA

Thermal Resistance (Junction−to−Ambient)

0 lfpm

500 lfpm

DFN8

DFN8

41 to 44 ± 5%

129

84

°C/W

°C/W

°C/W

Tsol

Wave Solder

Pb <2 to 3 sec @ 248°C

Pb−Free <2 to 3 sec @ 260°C

265

°C

265

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

http://onsemi.com

2

Share Link: