MC100LVEL37DWG(2016) Просмотр технического описания (PDF) - ON Semiconductor
Номер в каталоге
Компоненты Описание
производитель
MC100LVEL37DWG Datasheet PDF : 7 Pages
| |||
MC100LVEL37
PACKAGE DIMENSIONS
SOIC−20 WB
DW SUFFIX
CASE 751D−05
ISSUE H
D
A
q
20
11
E
1
10
20X b
B
0.25 M T A S B S
18X e
A
SEATING
PLANE
A1 T
c
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
MILLIMETERS
DIM MIN MAX
A 2.35 2.65
A1 0.10 0.25
b 0.35 0.49
c 0.23 0.32
D 12.65 12.95
E 7.40 7.60
e
1.27 BSC
H 10.05 10.55
h 0.25 0.75
L 0.50 0.90
q
0_ 7_
RECOMMENDED
SOLDERING FOOTPRINT*
20X
0.52
20X
1.30
20
11
11.00
1
10
1.27
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
6
Share Link: 