MC100ELT20DR2G Просмотр технического описания (PDF) - ON Semiconductor

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Компоненты Описание

производитель

MC100ELT20DR2G

5VTTL to Differential PECL Translator

ON Semiconductor 

MC10ELT20, MC100ELT20

NC 1

Q2

PECL

Q3

8 VCC

TTL 7 D

6 NC

NC 4

5 GND

Figure 1. 8−Lead Pinout (Top View)

and Logic Diagram

Table 1. PIN DESCRIPTION

Pin

Function

Q, Q

PECL Differential Outputs*

D

TTL Input

VCC

GND

Positive Supply

Ground

NC

No Connect

EP

Exposed pad must be connected to a sufficient

thermal conduit. Electrically connect to the most

negative supply or leave floating open.

*Output state undetermined when inputs are open.

Table 2. ATTRIBUTES

Characteristics

Internal Input Pulldown Resistor

Internal Input Pullup Resistor

ESD Protection

Human Body Model

Machine Model

Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)

SO−8

TSSOP−8

DFN8

Flammability Rating

Oxygen Index: 28 to 34

Transistor Count

Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test

1. For additional information, see Application Note AND8003/D.

Value

N/A

N/A

> 4 kV

> 200 V

Pb Pkg

Pb−Free Pkg

Level 1

Level 1

Level 1

Level 1

Level 3

Level 1

UL 94 V−0 @ 0.125 in

51 Devices

Table 3. MAXIMUM RATINGS

Symbol

Parameter

Condition 1

Condition 2

Rating

Unit

VCC

Positive Power Supply

VIN

Input Voltage

Iout

Output Current

GND = 0 V

GND = 0 V

Continuous

Surge

VI  VCC

7

V

7

V

50

mA

100

mA

TA

Operating Temperature Range

Tstg

Storage Temperature Range

qJA

Thermal Resistance (Junction−to−Ambient) 0 lfpm

500 lfpm

SO−8

SO−8

−40 to +85

−65 to +150

190

130

°C

°C

°C/W

°C/W

qJC

Thermal Resistance (Junction−to−Case)

Standard Board

qJA

Thermal Resistance (Junction−to−Ambient) 0 lfpm

500 lfpm

SO−8

TSSOP−8

TSSOP−8

41 to 44

185

140

°C/W

°C/W

°C/W

qJC

Thermal Resistance (Junction−to−Case)

Standard Board

qJA

Thermal Resistance (Junction−to−Ambient) 0 lfpm

500 lfpm

TSSOP−8

DFN8

DFN8

41 to 44

129

84

°C/W

°C/W

°C/W

Tsol

Wave Solder

Pb < 3 s @ 248°C

Pb−Free < 3 s @ 260°C

265

°C

265

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

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