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MC100EL13 Просмотр технического описания (PDF) - ON Semiconductor

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Компоненты Описание
производитель
MC100EL13
ON-Semiconductor
ON Semiconductor ON-Semiconductor
MC100EL13 Datasheet PDF : 6 Pages
1 2 3 4 5 6
MC100EL13
Q1a Q1a Q2a Q2a VCC Q2b Q2b Q1b Q1b VEE
20 19 18 17 16 15 14 13 12 11
Table 1. PIN DESCRIPTION
PIN
FUNCTION
Qna, Qna
Qnb, Qnb
CLKn, CLKn
VCC
VEE
ECL Differential Clock Outputs
ECL Differential Clock Outputs
ECL Differential Clock Inputs
Positive Supply
Negative Supply
1 2 3 4 5 6 7 8 9 10
Q0a Q0a VCC CLKa CLKa CLKb CLKb VCC Q0b Q0b
* All VCC pins are tied together on the die.
Warning: All VCC and VEE pins must be externally connected
to Power Supply to guarantee proper operation.
Figure 1. Logic Diagram and Pinout: Assignment
Table 2. ATTRIBUTES
Characteristics
Value
Internal Input Pulldown Resistor
75 kW
Internal Input Pullup Resistor
75 kW
ESD Protection
Human Body Model
Machine Model
Charge Device Model
> 2 kV
> 200 V
> 4 kV
Moisture Sensitivity (Note 1)
Level 1
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V0 @ 0.125 in
Transistor Count
143 Devices
Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional Moisture Sensitivity information, refer to Application Note AND8003/D.
Table 3. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
PECL Mode Power Supply
VEE
NECL Mode Power Supply
VI
PECL Mode Input Voltage
NECL Mode Input Voltage
VEE = 0 V
VCC = 0 V
VEE = 0 V
VCC = 0 V
VI VCC
VI VEE
Iout
Output Current
Continuous
Surge
IBB
VBB Sink/Source
TA
Operating Temperature Range
Tstg
Storage Temperature Range
qJA
Thermal Resistance (JunctiontoAmbient) 0 lfpm
500 lfpm
SO20L
SO20L
qJC
Thermal Resistance (JunctiontoCase)
Standard Board
SO20L
Tsol
Wave Solder
Pb <2 to 3 sec @ 248°C
PbFree <2 to 3 sec @ 260°C
8
8
6
6
50
100
± 0.5
40 to +85
65 to +150
90
60
30 to 35
265
265
V
V
V
V
mA
mA
mA
°C
°C
°C/W
°C/W
°C/W
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
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