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MBRS130T3 Datasheet PDF : 3 Pages
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MBRS130T3
Preferred Device
Surface Mount
Schottky Power Rectifier
This device employs the Schottky Barrier principle in a large area
metal-to-silicon power diode. State-of-the-art geometry features
epitaxial construction with oxide passivation and metal overlay
contact. Ideally suited for low voltage, high frequency rectification, or
as free wheeling and polarity protection diodes in surface mount
applications where compact size and weight are critical to the system.
Features
•ăSmall Compact Surface Mountable Package with J-Bend Leads
•ăRectangular Package for Automated Handling
•ăHighly Stable Oxide Passivated Junction
•ăVery Low Forward Voltage Drop (0.6 Volts Max @ 1.0 A, TJ = 25°C)
•ăExcellent Ability to Withstand Reverse Avalanche Energy Transients
•ăGuardring for Stress Protection
•ăPb-Free Package is Available
Mechanical Characteristics
•ăCase: Epoxy, Molded
•ăWeight: 95 mg (approximately)
•ăFinish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
•ăLead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
•ăShipped in 12 mm Tape and Reel, 2500 units per reel
•ăCathode Polarity Band
MAXIMUM RATINGS
Rating
Symbol Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
30
V
VRWM
VR
Average Rectified Forward Current
(TL = 115°C)
IF(AV)
1.0
A
Non-Repetitive Peak Surge Current
IFSM
40
A
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
Operating Junction Temperature
TJ -65 to +125 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Rating
Symbol Value
Unit
Thermal Resistance, Junction-to-Lead
(TL = 25°C)
RqJL
12
°C/W
http://onsemi.com
SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERE
30 VOLTS
SMB
CASE 403A
PLASTIC
MARKING DIAGRAM
AYWW
B13G
G
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb-Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
MBRS130T3
SMB
2500/Tape & Reel
MBRS130T3G
SMB
2500/Tape & Reel
(Pb-Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
©Ă Semiconductor Components Industries, LLC, 2007
1
August, 2007 - Rev. 7
Publication Order Number:
MBRS130T3/D
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