MBF9045BC Просмотр технического описания (PDF) - Oki Electric Industry

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Компоненты Описание

производитель

MBF9045BC

SAW Antenna Duplexer (700 to 1000 MHz)

Oki Electric Industry 

OKI Semiconductor

FEDW9045BC-03

MBF9045BC

RECOMMENDATION FOR SOLDER PAD PATTERN

The solder pad pattern should be designed by customers because it depends on the electrical

performance of the customers’ system. Following is an example of solder pad pattern which is used in

OKI’s package evaluation board. Please be noted that this is for reference purpose only.

25 µm

0.1 mm

25 µm

0.5 mm

0.1 mm

0.1 mm

PCB pad pattern

Metal mask pattern

Pad of Device

Please pay attention to the following items to maintain electrical performance.

(1) Metal mask pattern for cream solder should be 25 µm smaller on each side. Metal mask is 0.15 mm in

thickness.

(2) As the impedance of Tx, Rx, ANT is designed for 50Ω, please consider this for the design of mother board.

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