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MAX4410 Просмотр технического описания (PDF) - Maxim Integrated

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MAX4410 Datasheet PDF : 20 Pages
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80mW, DirectDrive Stereo Headphone Driver
with Shutdown
ABSOLUTE MAXIMUM RATINGS
PGND to SGND .....................................................-0.3V to +0.3V
PVDD to SVDD .................................................................-0.3V to +0.3V
PVSS to SVSS .........................................................-0.3V to +0.3V
PVDD and SVDD to PGND or SGND .........................-0.3V to +4V
PVSS and SVSS to PGND or SGND ..........................-4V to +0.3V
IN_ to SGND ..........................................................-0.3V to +0.3V
SHDN_ to SGND........................(SGND - 0.3V) to (SVDD + 0.3V)
OUT_ to SGND ............................(SVSS - 0.3V) to (SVDD + 0.3V)
C1P to PGND.............................(PGND - 0.3V) to (PVDD + 0.3V)
C1N to PGND .............................(PVSS - 0.3V) to (PGND + 0.3V)
Output Short Circuit to GND or VDD...........................Continuous
Continuous Power Dissipation (TA = +70°C)
14-Pin TSSOP (derate 9.1mW/°C above +70°C) ..........727mW
16-Bump UCSP (derate 15.2mW/°C above +70°C)....1212mW
Junction Temperature ......................................................+150°C
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Bump Temperature (soldering) (Note 1)
Infrared (15s) ...............................................................+220°C
Vapor Phase (60s) .......................................................+215°C
Lead Temperature (soldering, 10s) .................................+300°C
Note 1: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom-
mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow.
Preheating is required. Hand or wave soldering is not allowed.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(PVDD = SVDD = 3V, PGND = SGND = 0, SHDNL = SHDNR = SVDD, C1 = C2 = 2.2µF, RIN = RF = 10k, RL = , TA = TMIN to TMAX,
unless otherwise noted. Typical values are at TA = +25°C.) (Note 2)
PARAMETER
Supply Voltage Range
Quiescent Supply Current
Shutdown Supply Current
SHDN_ Thresholds
SHDN_ Input Leakage Current
SHDN_ to Full Operation
CHARGE PUMP
Oscillator Frequency
AMPLIFIERS
Input Offset Voltage
Input Bias Current
Power-Supply Rejection Ratio
Output Power
SYMBOL
VDD
IDD
I SHDN
CONDITIONS
Guaranteed by PSRR test
One channel enabled
Two channels enabled
SHDNL = SHDNR = GND
VIH
VIL
tSON
fOSC
VOS
IBIAS
PSRR
POUT
Input AC-coupled, RL = 32
1.8V VDD 3.6V
200mVP-P ripple
THD + N = 1%
DC
fRIPPLE = 1kHz
fRIPPLE = 20kHz
RL = 32
RL = 16
MIN
1.8
0.7 x
SVDD
-1
TYP
4
7
6
175
MAX
3.6
UNITS
V
mA
11.5
10
µA
V
0.3 x
SVDD
+1
µA
µs
272 320
368
kHz
0.5
2.4
mV
-100
+100
nA
75
90
90
dB
55
65
mW
40
80
2 _______________________________________________________________________________________

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