MAX16922ATPB/V Просмотр технического описания (PDF) - Maxim Integrated
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MAX16922ATPB/V Datasheet PDF : 18 Pages
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MAX16922
2.2MHz, Dual, Step-Down DC-DC
Converters, Dual LDOs, and RESET
Pin Description (continued)
PIN
TQFN
TSSOP
NAME
FUNCTION
OUT2 Voltage Sense Input. Connect OUTS2 directly to the OUT2 output voltage and bypass
8
10
OUTS2
to PGND2 with a minimum total capacitance of 10µF. The total capacitance can include input
bypass capacitors cascaded from OUT2, discharged by a 70Ω resistance between OUTS2
and PGND2 when disabled.
9
11
PGND2 Power Ground for BUCK 2. Connect PGND2 and GND_ together near the device.
10
12
LX2
Inductor Connection for OUT2. Connect a 2.2µH inductor between LX2 and OUT2 as shown
in the Functional Diagram.
11
13
PV2 OUT2 Supply Input. Connect a 4.7µF or larger ceramic capacitor from PV2 to ground.
12
14
PV3
Linear-Regulator Power Input for OUT3. Bypass PV3 to GND with a minimum 2.2µF ceramic
capacitor.
13
15
OUT3
Linear-Regulator 1 Output. Bypass OUT3 to GND with a minimum 2.2µF ceramic capacitor
internally discharged by a 1kΩ resistance when disabled.
14
16
GND2 Ground. Connect GND, GND1, GND2, and GND3 together.
15
17
OUT4
Linear-Regulator 2 Output. Bypass OUT4 to GND with a minimum 2.2µF ceramic capacitor.
Internally discharged by a 1kΩ resistance when disabled.
16
18
PV4
Linear-Regulator Power Input for OUT4. Bypass PV4 to GND with a minimum 2.2µF ceramic
capacitor.
17
19
LSUP
5V Logic Supply to Provide Power to Internal Circuitry. Bypass LSUP to GND1 with a 1µF
ceramic capacitor.
18
20
RESET
Open-Drain Reset Output for the Input Monitoring OUT1 and OUT2. External pullup
required.
19
1
GND1 Ground. Connect GND, GND1, GND2, and GND3 together.
20
2
EN
Active-High Enable Input. Connect EN to PV1 or a logic-high voltage to turn on all
regulators. Pull EN input low to place the regulators in shutdown.
Exposed Pad. Connect the exposed pad to ground. Connecting the exposed pad to ground
—
—
EP
does not remove the requirement for proper ground connections to PGND2 and GND_. The
exposed pad is attached with epoxy to the substrate of the die, making it an excellent path to
remove heat from the device.
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