MAAPGM0060-DIE Просмотр технического описания (PDF) - Tyco Electronics
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MAAPGM0060-DIE Datasheet PDF : 5 Pages
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Amplifier, Power, 5W
4.8-6.7 GHz
Assembly and Bonding Diagram
100 pF
100 pF
100 pF
MAAPGM0060-DIE
903186 —
Preliminary Information
RFIN
RFOUT
VGG
100 Ω
0.1 μF
100 pF
100 pF
100 pF
VDD
0.1 μF
Figure 8. Recommended bonding diagram for pedestal mount.
Support circuitry typical of MMIC characterization.
Assembly Instructions:
Die attach: Use AuSn (80/20) 1 mil. preform solder. Limit time @ 300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques.
For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge
bonds of shortest length, although ball bonds are also acceptable.
Biasing Note: Must apply negative bias to VGG before applying positive bias to VDD to prevent
damage to amplifier.
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product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
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Visit www.macom.com for additional data sheets and product information.
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