M650P155.5200 Просмотр технического описания (PDF) - Integrated Circuit Systems
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M650P155.5200 Datasheet PDF : 6 Pages
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Integrated Circuit Systems
M650 Series
Performance Specifications
IR REFLOW PROFILE
IR Reflow Profile
(Vendor Recommendation)
220
180
150
100
50
60
60–90
105–150
Time (seconds)
Micro Networks has subjected their VCSO component
to various reflow profiles and test conditions for
optimum substrate mounting performance. The
conditions suggested here are recommended
temperature settings for the VCSO device during the
reflow processes. The best case condition for the
device is a slow ramp up to prevent thermal shock
before reaching reflow temperatures of Sn/Pb flux
activated solder with a melting point of 183 degree
Celsius. The M650 device should not see
temperatures above 183 degrees Celsius for an
extended periods beyond 60 seconds. Maximum
peak temperature for the device should not exceed
220 degrees Celsius for longer then 20 seconds.
Micro Networks has designed the M650 device as a
sealed unit. The package is 100% tested for seal
defects. Aqueous, solvent, or other wash type
cleaning methods is acceptable for this device.
TAPE & REEL
G
J
C
D
B
A
F
N
I
L
M
E
O
K
H
TAPE & REEL DIMENSIONS
TAPE MM REEL MM
A
24
F
1.78
B
11.5
G
21
C
1.5
H
13
D
4
I
100
E
12
J
5
M
9.2
K
25
N
14.5
L
330
O
3.7
No. per Reel: 300 Max
Integrated Circuit Systems, Inc. Communications Modules
4
www.icst.com/Comm-Modules
tel: 508-852-5400
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