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STLM20W89(2007) Просмотр технического описания (PDF) - STMicroelectronics

Номер в каталоге
Компоненты Описание
производитель
STLM20W89
(Rev.:2007)
ST-Microelectronics
STMicroelectronics ST-Microelectronics
STLM20W89 Datasheet PDF : 16 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Maximum rating
3
Maximum rating
STLM20
Stressing the device above the rating listed in the Absolute Maximum Ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 5. Absolute maximum ratings
Symbol
Parameter
Value
Unit
TSTG
TSLD(1)
VO
VCC
IO
TJ(max)
θJA
TA(2)
Storage temperature
Lead solder temperature for 10 seconds
Output voltage
Supply voltage
Output current
Maximum junction temperature
Thermal resistance
SOT323-5
(SC70-5)
UDFN
Ambient operating temperature
Grade 7
Grade 9
–65 to +150
260
–0.6 to VCC + 0.6
–0.2 to 6.5
10
150
331.4
160.2
–55 to 130
–40 to 85
°C
°C
V
V
mA
°C
°C/W
°C/W
°C
°C
1. Reflow at peak temperature of 255°C to 260°C for < 30 seconds (total thermal budget not to exceed 180°C
for between 90 to 150 seconds).
2. Grade 7: STLM20W87F
Grade 9: STLM20DD9F
8/16

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