INTEGRATED PRODUCTS
LX1732
High Current PFM Boost Converter
PRODUCTION DATA SHEET
DU
PACKAGE DIMENSIONS
8-Pin Miniature Shrink Outline Package (MSOP)
A
B
H
N
G
P
M
C
D
Dim
A
B
C
D
G
H
J
K
L
M
N
P
K
L
MILLIMETERS
MIN MAX
2.85 3.05
2.90 3.10
–
1.10
0.25 0.40
0.65 BSC
0.38 0.64
0.13 0.18
0.95 BSC
0.40 0.70
3°
0.05 0.15
4.75 5.05
INCHES
MIN MAX
.112 .120
.114 .122
– 0.043
0.009 0.160
0.025 BSC
0.015 0.025
0.005 0.007
0.037 BSC
0.016 0.027
3°
0.002 0.006
0.187 0.198
Note: Dimensions do not include mold flash or protrusions; these shall not exceed 0.155mm(0.006”) on any side. Lead dimension shall
not include solder coverage.
Copyright © 2000
Rev. 1.1c, 2005-03-03
Microsemi
Integrated Products
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
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