LTM4605 Просмотр технического описания (PDF) - Linear Technology
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LTM4605 Datasheet PDF : 24 Pages
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APPLICATIONS INFORMATION
Table 4. 5V Output
DERATING CURVE
Figure 7, 9
Figure 7, 9
Figure 7, 9
Figure 8, 10
Figure 8, 10
Figure 8, 10
VIN (V)
12, 16
12, 16
12, 16
12, 16
12, 16
12, 16
POWER LOSS CURVE
Figure 5
Figure 5
Figure 5
Figure 5
Figure 5
Figure 5
AIR FLOW (LFM)
0
200
400
0
200
400
LTM4605
HEATSINK
none
none
none
BGA Heatsink
BGA Heatsink
BGA Heatsink
θJA (°C/W)*
11.2
8.3
7.2
10.7
7.7
6.6
Table 5. 20V Input and 12V Output
DERATING CURVE
Figure 11
VIN (V)
20
Figure 11
20
Figure 11
20
Figure 12
20
Figure 12
20
Figure 12
20
POWER LOSS CURVE
Figure 6
Figure 6
Figure 6
Figure 6
Figure 6
Figure 6
AIR FLOW (LFM)
0
200
400
0
200
400
HEATSINK
none
none
none
BGA Heatsink
BGA Heatsink
BGA Heatsink
θJA (°C/W)*
8.2
5.8
5.3
7.6
5.3
4.8
HEATSINK MANUFACTURER
PART NUMBER
PHONE NUMBER
Wakefield Engineering
LTN20069
603-635-2600
*The results of thermal resistance from junction to ambient θJA are based on the demo board of DC1198A. Thus, the maximum temperature on board is
treated as the junction temperature (which is in the μModule for most cases) and the power losses from all components are counted for calculations. It has
to be mentioned that poor board design may increase the θJA.
4605fa
19
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