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LTC3450 Просмотр технического описания (PDF) - Linear Technology

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Компоненты Описание
производитель
LTC3450 Datasheet PDF : 12 Pages
First Prev 11 12
PACKAGE DESCRIPTIO
UD Package
16-Lead Plastic QFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1691)
LTC3450
0.57 ±0.05
3.35 ± 0.05
1.45 ± 0.05
2.20 ± 0.05 (4 SIDES)
PACKAGE OUTLINE
0.23 ±0.05
0.50 BCS
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
3.00 ± 0.10
(4 SIDES)
PIN 1
TOP MARK
0.75 ± 0.05
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
15 16
0.40 ± 0.10
1
1.45 ± 0.10
2
(4-SIDES)
0.200 REF
0.00 – 0.05
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-2)
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
(UD) QFN 0802
0.23 ± 0.05
0.50 BSC
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3450f
11

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