LM319 Просмотр технического описания (PDF) - STMicroelectronics

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производитель

LM319

High speed dual comparators

STMicroelectronics 

LM119-LM219-LM319

5

Package information

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

5.1

DIP14 package information

Figure 20. DIP14 package mechanical drawing

Table 4.

Ref.

a1

B

b

b1

D

E

e

e3

F

I

L

Z

DIP14 package mechanical data

Dimensions

Millimeters

Min.

0.51

1.39

1.27

Typ.

0.5

0.25

8.5

2.54

15.24

3.3

Max.

1.65

20

7.1

5.1

2.54

Min.

0.020

0.055

0.050

Inches

Typ.

0.020

0.010

0.335

0.100

0.600

0.130

Max.

0.065

0.787

0.280

0.201

0.100

9/12

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