LH532100BSR Просмотр технического описания (PDF) - Sharp Electronics

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Компоненты Описание

производитель

LH532100BSR

CMOS 2M (256K × 8) MROM

Sharp Electronics 

LH532100B

32QFJ (QFJ032-P-R450)

29

30

21

20

CMOS 2M MROM

1

11.40 [0.449]

12.50 [0.492]

12.30 [0.484]

10.90 [0.429]

10.10 [0.398]

4

14

5

13

14.00 [0.551]

15.10 [0.594]

14.90 [0.587]

0.25 [0.010]

1.20 [0.047]

1.20 [0.047]

3.50 [0.138]

2.30 [0.091] 3.10 [0.122]

1.90 [0.075]

1.27 [0.050]

TYP.

0.56 [0.022]

0.36 [0.014]

13.50 [0.531]

12.70 [0.500]

DIMENSIONS IN MM (INCHES)

MAXIMUM LIMIT

MINIMUM LIMIT

32-pin, 450-mil QFJ (PLCC)

32QFJ450

ORDERING INFORMATION

LH532100B

X

Device Type Package

D 32-pin, 600-mil DIP (DIP032-P-0600)

N 32-pin, 525-mil SOP (SOP032-P-0525)

U 32-pin, 450-mil QFJ (PLCC) (QFJ032-P-R450)

T 32-pin, 8 x 20 mm2 TSOP (Type I) (TSOP032-P-0820)

S 32-pin, 400-mil TSOP (Type II) (TSOP032-P-0400)

SR 32-pin, 400-mil TSOP (Type II) Reverse bend (TSOP032-P-0400)

CMOS 2M (256K x 8) Mask-Programmable ROM

Example: LH532100BD (CMOS 2M (256K x 8) Mask-Programmable ROM, 32-pin, 600-mil DIP)

532100B-6

8

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