LC573104A Просмотр технического описания (PDF) - SANYO -> Panasonic
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LC573104A Datasheet PDF : 16 Pages
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LC573104A, 573102A
Die Specifications
Chip size :
Chip thickness :
Pad size :
Pad Layout
3.51mm×3.19mm
480µm
120µm×120µm
Pad coordinates
MFP24S pin assignment
Pad Pin
X
No. Name (µm)
17 1 VDD
18 2 CA
1465
1155
19 3 P20
– 305
20 4 P21
– 1485
21 5 P00
– 1485
22 6 P01
– 1485
23 7 P02
– 1485
24 8 P03
– 1485
1 9 P10
– 1485
2 10 P11
– 1485
3 11 P12
– 1485
4 12 P13
– 1485
5 13 S1
– 410
Y
(µm)
1365
1365
1365
1365
1110
870
565
325
20
– 220
– 480
– 1395
– 1395
MFP24S pin assignment
Pad Pin
X
No. Name (µm)
6 14 S2
360
7 15 S3
560
8 16 S4
760
– 17 TEST
960
– 18 TEST
1140
9 19 M1
1560
10 20 M2
1560
11 21 M3
1560
12 22 M4
1560
13 23 RES
1465
14 24 VSS
15 25 CF1
1465
1465
16 26 CF2
1465
Y
(µm)
– 1395
– 1395
– 1395
– 1395
– 1395
– 1395
– 905
– 685
– 445
330
570
755
1155
• The chip center is the origin of the above pad coordinates.
The X, Y values represent the coordinate of the pad center.
• When dipping the MFP24S package in solder to mount on boards, contact SANYO for instructions, etc.
• Chip substrate should be connected to VSS or left open.
No.4144–5/16
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