L9218A Просмотр технического описания (PDF) - Agere -> LSI Corporation

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L9218A

Low-Cost Line Interface

Agere -> LSI Corporation 

L9218A/G Low-Cost Line Interface

Data Sheet

November 2001

Electrical Characteristics

Minimum and maximum values are testing requirements in the temperature range of 25 °C to 85 °C and battery

range of –24 V to –70 V. These minimum and maximum values are guaranteed to –40 °C based on component

simulations and design verification of samples, but devices are not tested to –40 °C in production. The test circuit

shown in Figure 4 is used, unless otherwise noted. Positive currents flow into the device.

Typical values are characteristics of the device design at 25 °C based on engineering evaluations and are not part

of the test requirements. Supply values used for typical characterization are VCC = 5.0 V, VBAT = –48 V, unless oth-

erwise noted.

Table 4. Power Supply

Parameter

Power Supply—Powerup, No Loop Current:

ICC

IBAT (VBAT = –48 V)

Power Dissipation (VBAT = –48 V)

Power Supply—Scan, No Loop Current:

ICC

IBAT (VBAT = –48 V)

Power Dissipation (VBAT = –48 V)

Power Supply—Disconnect, No Loop Current:

ICC

IBAT (VBAT = –48 V)

Power Dissipation (VBAT = –48 V)

Power Supply Rejection 500 Hz to 3 kHz

(See Figure 5 and Figure 6)1:

VCC

VBAT

Thermal Protection Shutdown (Tjc)3

Thermal Resistance, Junction to Ambient (θJA)2, 3:

Natural Convection 2S2P Board

Natural Convection 2S0P Board

Wind Tunnel 100 Linear Feet per Minute (LFPM) 2S2P Board

Wind Tunnel 100 Linear Feet per Minute (LFPM) 2S0P Board

Min Typ Max Unit

—

4.6

5.6 mA

—

–2.4 –2.7 mA

—

138 158 mW

—

2.8

3.8 mA

—

–0.8 –1.0 mA

—

52

67 mW

—

1.6

—

mA

— –0.12 —

mA

—

14

— mW

30

—

40

—

150 165

—

30

—

43

—

27

—

36

—

dB

—

dB

—

°C

— °C/W

— °C/W

— °C/W

— °C/W

1. This parameter is not tested in production. It is guaranteed by design and device characterization.

2. Careful thermal design as a function of maximum battery, loop length, maximum ambient temperature package thermal resistance, airflow,

PCB board layers, and other related parameters must ensure that thermal shutdown temperature is not exceeded under normal use condi-

tions.

3. Airflow, PCB board layers, and other factors can greatly affect this parameter.

8

Agere Systems Inc.

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