L6206 Просмотр технического описания (PDF) - STMicroelectronics
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L6206 Datasheet PDF : 23 Pages
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L6206
THERMAL DATA
Symbol
Rth-j-pins
Rth-j-case
Rth-j-amb1
Rth-j-amb1
Rth-j-amb1
Rth-j-amb2
Description
MaximumThermal Resistance Junction-Pins
Maximum Thermal Resistance Junction-Case
MaximumThermal Resistance Junction-Ambient 1
Maximum Thermal Resistance Junction-Ambient 2
MaximumThermal Resistance Junction-Ambient 3
Maximum Thermal Resistance Junction-Ambient 4
PowerDIP24
18
-
43
-
-
58
SO24
14
-
51
-
-
77
PowerSO36
-
1
-
35
15
62
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
(1) Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the bottom side of 6 cm2 (with a thickness of 35 µm).
(2) Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the top side of 6 cm2 (with a thickness of 35 µm).
(3) Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the top side of 6 cm2 (with a thickness of 35 µm), 16 via holes
and a ground layer.
(4) Mounted on a multi-layer FR4 PCB without any heat sinking surface on the board.
PIN CONNECTIONS (Top View)
IN1A
IN2A
SENSEA
OCDA
OUT1A
GND
GND
OUT1B
OCDB
SENSEB
IN1B
IN2B
1
24
2
23
3
22
4
21
5
20
6
19
7
18
8
17
9
16
10
15
11
14
12
13
D99IN1089A
PROGCLA
ENA
VCP
OUT2A
VSA
GND
GND
VSB
OUT2B
VBOOT
ENB
PROGCLB
PowerDIP24/SO24
GND
N.C.
N.C.
VSA
OUT2A
N.C.
VCP
ENA
PROGCLA
IN1A
IN2A
SENSEA
OCDA
N.C.
OUT1A
N.C.
N.C.
GND
1
36
2
35
3
34
4
33
5
32
6
31
7
30
8
29
9
28
10
27
11
26
12
25
13
24
14
23
15
22
16
21
17
20
18
19
D99IN1090A
PowerSO36(5)
GND
N.C.
N.C.
VSB
OUT2B
N.C.
VBOOT
ENB
PROGCLB
IN2B
IN1B
SENSEB
OCDB
N.C.
OUT1B
N.C.
N.C.
GND
(5) The slug is internally connected to pins 1,18,19 and 36 (GND pins).
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