L6206 Просмотр технического описания (PDF) - STMicroelectronics
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L6206 Datasheet PDF : 23 Pages
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L6206
APPLICATION INFORMATION
A typical application using L6206 is shown in Fig. 12. Typical component values for the application are shown
in Table 2. A high quality ceramic capacitor in the range of 100 to 200 nF should be placed between the power
pins (VSA and VSB) and ground near the L6206 to improve the high frequency filtering on the power supply and
reduce high frequency transients generated by the switching. The capacitors connected from the ENA/OCDA
and ENB/OCDB nodes to ground set the shut down time for the Brgidge A and Bridge B respectively when an
over current is detected (see Overcurrent Protection). The two current sources (SENSEA and SENSEB) should
be connected to Power Ground with a trace length as short as possible in the layout. To increase noise immu-
nity, unused logic pins are best connected to 5V (High Logic Level) or GND (Low Logic Level) (see pin descrip-
tion). It is recommended to keep Power Ground and Signal Ground separated on PCB.
Table 2. Component Values for Typical Application
C1
100uF
D1
C2
100nF
D2
CBOOT
220nF
RCLA
CP
10nF
RCLB
CENA
5.6nF
RENA
CENB
5.6nF
RENB
CREF
68nF
RP
1N4148
1N4148
5KΩ
5KΩ
100kΩ
100kΩ
100Ω
Figure 12. Typical Application
+
VS
8-52VDC
C1
POWER
GROUND
-
SIGNAL
GROUND
VSA 20
C2
VSB 17
D1
RP
VCP
22
CBOOT
D2
CP
VBOOT
15
SENSEA 3
SENSEB 10
LOADA
LOADB
OUT1A 5
OUT2A 21
OUT1B 8
OUT2B 16
18
GND
19
GND
6
GND
7
GND
4 OCDA
ENA
23
9 OCDB
ENB
14
RENA
CENA
RENB
CENB
ENA
ENB
11 IN1B
12 IN2B
1 IN1A
2 IN2A
IN1B
IN2B
IN1A
IN2A
24 PROGCLA
RCLA
13 PROGCLB
RCLB
D02IN1344
13/23
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