Pad Assignment
(0 ,0 )
Pad Coordinates
Pad No.
1
2
3
X
-506.50
61.00
510.50
HT75XX
Unit: mm
Y
-589.50
-582.50
-585.50
1
2
3
Chip size: 1390 ´ 1530 (mm)2
*The IC substrate should be connected to VDD in the PCB layout artwork.
Absolute Maximum Ratings
Supply Voltage...............................-0.3V to 26V
Power Consumption.............................. 250mW
Storage Temperature.................-50°C to 125°C
Operating Temperature ..................0°C to 70°C
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maxi-
mum Ratings² may cause substantial damage to the device. Functional operation of this device
at other conditions beyond those listed in the specification is not implied and prolonged expo-
sure to extreme conditions may affect device reliability.
3
May 2, 2000