IS22C040 Просмотр технического описания (PDF) - Integrated Silicon Solution
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IS22C040 Datasheet PDF : 13 Pages
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IS22C040
BONDING DIAGRAM
6
5
7
4
8
3
9
2
10
1
11
20
12
19
13
18
14
17
Y 15
16
X
(0,0)
Note: Substrate must be connected to GND
Pad size = 100 µm x 100 µm
ISSI ®
BONDING PARAMETERS
Pin
Name
X
Y
1
S8
3451.9 1599.7
2
LED1
3451.9 1861.0
3
VOUT1
3451.9 2147.6
4
VOUT2
3451.9 2444.5
5
GND
3368.10 2803.35
6
STP
137.18 2795.93
7
LED2
100.4 2486.3
8
COUT
100.4 2245.0
9
OSC
100.4 1790.0
10
S5
100.4 1469.5
11
S6
100.4 1230.0
12
VPP
100.4
989.6
13
S1
100.4
662.3
14
S2
100.4
422.7
15
VCC
187.05 113.78
16
S3
3372.5
141.8
17
S4
3451.9
581.5
18
SBT
3451.9
836.0
19
IRP
3451.9 1090.6
20
S7
3451.94 1345.13
Integrated Silicon Solution, Inc. — 1-800-379-4774
5
Rev. D
02/25/00
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