IP2001TR Просмотр технического описания (PDF) - International Rectifier
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Компоненты Описание
производитель
IP2001TR Datasheet PDF : 10 Pages
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0.15 [.006] C
2X
6
BALL A1
CORNER ID
11.00
[.433]
TOP VIEW
iP2001
BA
11.00
[.433]
5C
0.12 [.005] C
0.15 [.006] C
2X 6
133X Ø
0.55 [.0216]
0.45 [.0178]
7
0.15 [.006]
0.08 [.003]
CAB
C
0.45 [.0177]
0.35 [.0138]
NOTES:
1. DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994.
2. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES].
3. CONTROLLING DIMENSION: MILLIMETER
4. SOLDER BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
5 PRIMARY DATUM C (SEATING PLANE) IS DEFINED BY THE
SPHERICAL CROWNS OF THE SOLDER BALLS.
6 BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE
PACKAGE BODY.
7 SOLDER BALL DIAMETER IS MEASURED AT THE MAXIMUM SOLDER
BALL DIAMETER, IN A PLANE PARALLEL TO DATUM C.
0.40
[.016]
4X
BOTTOM VIEW
0.80
[.032]
22X
(4X 1.1 [.043])
2.66 [.1047]
2.46 [.0969]
3.11 [.1224]
2.81 [.1107]
SIDE VIEW
Mechanical Drawing
Refer to the following application notes for detailed guidelines and suggestions when
implementing iP0WIR Technology products:
AN-1028: Recommended Design, Integration and Rework Guidelines for International Rectifier’s
iPOWIR Technology BGA Packages
This paper discusses the assembly considerations that need to be taken when mounting iPOWIR BGA’s
on printed circuit boards. This includes soldering, pick and place, reflow, inspection, cleaning and
reworking recommendations.
AN-1029: Optimizing a PCB Layout for an iPOWIR Technology Design
This paper describes how to optimize the PCB layout design for both thermal and electrical performance.
This includes placement, routing, and via interconnect suggestions.
AN-1030: Applying iPOWIR Products in Your Thermal Environment
This paper explains how to use the Power Loss and SOA curves in the data sheet to validate if the
operating conditions and thermal environment are within the Safe Operating Area of the iPOWIR product.
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