HX6408 Просмотр технического описания (PDF) - Honeywell International
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HX6408 Datasheet PDF : 11 Pages
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HX6408
Advanced Information
PACKAGE OUTLINE
COMMON DIMENSIONS
SYM
A
A1
B
C
D
E
E1
L
Q
MIN.
.102
.085
.016
.004
.910
.045
.832
-----
-----
NOM.
.113
.095
.018
.006
.920
.050
.840
.450
.104
MAX.
.125
.105
.020
.008
.930
.055
.848
-----
-----
ORDERING INFORMATION (1)
H
X
6408
X
S
H
N
PART NUMBER
PROCESS
X = SOI
SCREEN LEVEL
V = QML Class V Equivalent (4)
Q = QML Class Q Equivalent (4)
S = Level S
E = Eng. Model (2)
MODE (3)
N = Non-Sleep Mode
M = Sleep Mode
Source
H = Honeywell
PACKAGE DESIGNATION
X = 36 Lead FP
K = Known Good Die
- = Bare Die (no package)
TOTAL DOSE HARDNESS
R = 1x105 rad (SiO2)
F = 3x105 rad (SiO2)
H = 1x106 rad (SiO2)
N = No Level Guaranteed (2)
(1) Orders may be faxed to 763-954-2051. Please contact our Customer Service Representative at 763-954-2888 for further information.
(2) Engineering Device Description: Parameters are tested -55°C to 125°C, 24 hour burn-in, IDDSB = 10 mA, no radiation Guaranteed.
(3) With the Non-Sleep Mode option, Pin 36 is a no-connect (NC), and is not wirebonded to the chip. With the Sleep Mode, Pin 36 has the
NSL function.
(4) These devices are screened to QML levels but are not QML certified.
For more information about Honeywell’s family of radiation hardened integrated circuit products and services,
visit www.myspaceparts.com.
Honeywell reserves the right to make changes to any products or technology herein to improve reliability, function or design. Honeywell does not assume any
liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of
others.
Honeywell International Inc.
Aerospace Electronics Systems
Defense & Space Electronics Systems
12001 Highway 55
Plymouth, MN 55441
11-1800-3w23w-8w2.9h5oneywell.com
Form #900918
June 2005
©2005 Honeywell International Inc.
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