HT672A Просмотр технического описания (PDF) - Holtek Semiconductor
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HT672A Datasheet PDF : 8 Pages
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Pin Assignment
HF 1
NC 2
NC 3
H FI 4
8 VCC
7 VPP
6 C LK
5 GND
H T672A
8 D IP -A
Note: The 8-pin DIP package type is supplied only
for engineering evaluation purposes and will not be
available in production volumes.
Pad Assignment
HT672A
1
65
(0 ,0 )
2
34
Chip size: 925 ´ 1040 (mm)2
* The IC substrate should be connected to VSS in the
PCB layout artwork.
Pad Coordinates
Pad No.
1
2
3
X
-256.65
-256.65
96.10
Y
357.34
-361.99
-378.15
Pad No.
4
5
6
X
228.70
219.80
88.89
Unit: mm
Y
-361.37
338.59
332.15
Pad Description
Pad
No.
Pad
Name
I/O
Internal
Connection
Description
1 HF2
I/O
CMOS Connect to an antenna coil for normal operation. Open for data programming.
2 HF1
I/O
CMOS Connect to an antenna coil for normal operation. Data I/O for programming.
3 VSS
¾
¾
Negative power supply, ground
4 CLK
I
CMOS Open for normal operation. Clock input for programming.
5 VPA
I
¾
Open for normal operation. High voltage supplies input for programming.
6 VDD ¾
¾
Open for normal operation, +5V supply input for programming.
Absolute Maximum Ratings
Supply Voltage (VDD) ...............................................6V
Supply Voltage (VPA) ..........................................12.5V
Input Voltage .............................VSS-0.3V to VDD+0.3V
Storage Temperature ...........................-50°C to 125°C
Operating Temperature ..............................0°C to 70°C
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed
in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.
Rev. 1.10
2
May 17, 2007
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