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HSDL-3602 Просмотр технического описания (PDF) - HP => Agilent Technologies

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Компоненты Описание
производитель
HSDL-3602
HP
HP => Agilent Technologies HP
HSDL-3602 Datasheet PDF : 25 Pages
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Moisture Proof Packaging
All HSDL-3602 options are shipped in moisture proof package. Once
opened, moisture absorption begins.
UNITS IN A SEALED
MOISTURE-PROOF
PACKAGE
PACKAGE IS
OPENED (UNSEALED)
Baking Conditions
If the parts are not stored in dry
conditions, they must be baked
before reflow to prevent damage
to the parts.
Package Temp. Time
In reels
60°C 48 hours
In bulk
100°C 4 hours
125°C 2 hours
150°C 1 hour
Baking should be done only once.
NO BAKING
IS NECESSARY
YES
ENVIRONMENT
LESS THAN 30°C,
AND LESS THAN
60% RH
YES
PACKAGE IS
OPENED LESS
THAN 72 HOURS
NO
PERFORM RECOMMENDED
NO
BAKING CONDITIONS
Recommended Storage Conditions
Storage
Temperature
10°C to 30°C
Relative
Humidity
below 60% RH
Time from Unsealing to Soldering
After removal from the bag, the
parts should be soldered within 3
days if stored at the recom-
mended storage conditions. If
times longer than 72 hours are
needed, the parts must be stored
in a dry box.
10

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