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HM67-B222 Просмотр технического описания (PDF) - BI Technologies

Номер в каталоге
Компоненты Описание
производитель
HM67-B222
BI-Technologies
BI Technologies BI-Technologies
HM67-B222 Datasheet PDF : 5 Pages
1 2 3 4 5
Outline Dimensions (Inch//mmm) )
Figure 1
Side View
.155
3.9 Max.
.004/0.10MAX
Seating Plane
Top View
.37
9.4
Max.
.10±.004
2.5±0.1
.236 Max.
6.0
Marking
(Refer to Specifications Table)
Figure 2
Bottom View
.024
0.60 Typ.
.138
3.50 Max.
.197
5.00 Max.
Top View
Marking Location
1
4
2
3
Side View
.140 Max.
3.55
.138 Max.
3.5
Recommended Solder Pad Layout
.098
2.5
.047
1.2
.177
4.5
.40
10.2
Recommended Solder Pad Layout
.090
2.3
.067
1.7
.087
2.2
.232
5.9
34 MAGNETIC COMPONENTS SELECTOR GUIDE 2006 EDITION
We reserve the right to change specifications without prior notice.
www.bitechnologies.com

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